Sökning: (WFRF:(Sun Peng 1979 )) srt2:(2008) >
Tensile properties ...
Tensile properties and microstructural characterization of Sn-0.7Cu-0.4Co bulk solder alloy for electronics applications
-
- Andersson, Cristina, 1969 (författare)
- Chalmers tekniska högskola,Chalmers University of Technology
-
- Sun, Peng, 1979 (författare)
- Chalmers tekniska högskola,Chalmers University of Technology
-
- Liu, Johan, 1960 (författare)
- Chalmers tekniska högskola,Chalmers University of Technology
-
(creator_code:org_t)
- Elsevier BV, 2008
- 2008
- Engelska.
-
Ingår i: Journal of Alloys and Compounds. - : Elsevier BV. - 0925-8388. ; 457:1/2, s. 97-105
- Relaterad länk:
-
http://dx.doi.org/10...
-
visa fler...
-
https://doi.org/10.1...
-
https://research.cha...
-
visa färre...
Abstract
Ämnesord
Stäng
- The ternary Sn–Cu–Co system eutectic composition was obtained by means of CALPHAD (CALculation of PHAse Diagram) methodology and it was found to be 0.4% Co and 0.7% Cu (wt%) with a melting point of 224 ◦C. The tensile behavior of this alloy was investigated at different strain rates (10−5, 10−4 and 10−3 s−1) and compared to both Sn–37Pb and Sn–4.0Ag–0.5Cu. The Sn–4.0Ag–0.5Cu alloy depicts the highest ultimate tensile strength (UTS) followed by the Sn–37P and finally the Sn–0.7Cu–0.4Co system. The elastic modulus was also higher for the Sn–4.0Ag–0.5Cu followed by the Sn–0.7Cu–0.4Co and last the Sn–37Pb. The microstructure of the Sn–0.7Cu–0.4Co alloy is composed of two types of intermetallic phases, (Cu,Co)6Sn5 and (Co,Cu)Sn2 dispersed in a Sn-rich matrix. The microstructure of this alloy proved to be very stable, after aging at 150 °C for 24 h. The eutectic Sn–0.7Cu–0.4Co solder alloy can therefore be a very good alternative for theSACalloys for surface mount technology applications.
Ämnesord
- TEKNIK OCH TEKNOLOGIER -- Materialteknik -- Annan materialteknik (hsv//swe)
- ENGINEERING AND TECHNOLOGY -- Materials Engineering -- Other Materials Engineering (hsv//eng)
- TEKNIK OCH TEKNOLOGIER -- Elektroteknik och elektronik -- Annan elektroteknik och elektronik (hsv//swe)
- ENGINEERING AND TECHNOLOGY -- Electrical Engineering, Electronic Engineering, Information Engineering -- Other Electrical Engineering, Electronic Engineering, Information Engineering (hsv//eng)
Nyckelord
- Lead-free
- Tensile properties
- Strain rate
- Solder alloy
- Sn-Cu-Co
Publikations- och innehållstyp
- art (ämneskategori)
- ref (ämneskategori)
Hitta via bibliotek
Till lärosätets databas