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  • Wang, WeiKTH,Materialvetenskap,Northeast Elect Power Univ, Dept Chem Engn, Jilin 132012, Jilin, Peoples R China. (author)

Inclusion engineering in Co-based duplex entropic alloys

  • Article/chapterEnglish2021

Publisher, publication year, extent ...

  • Elsevier BV,2021
  • printrdacarrier

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  • LIBRIS-ID:oai:DiVA.org:kth-303033
  • https://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-303033URI
  • https://doi.org/10.1016/j.matdes.2021.110097DOI

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  • Language:English
  • Summary in:English

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  • Subject category:ref swepub-contenttype
  • Subject category:art swepub-publicationtype

Notes

  • QC 20220309
  • Co-based duplex entropic alloy is designed very recently to replace pure Co as a major component of the binder phase for cemented carbide cutting tools. This work aims to provide a fundamental study of oxide inclusion characteristics in the duplex fcc + hcp Co-based entropic alloys. It is found that the Co85-xCrxFe7.5Ni7.5 (x = 15, 30 at.%) alloys hold the highest liquidus (T-liq) and solidus (T-sol) temperatures, compare with the Co85-xCrxMn7.5Ni7.5 (x = 15, 30 at.%) and Co77.5-xCrxFe7.5Mn7.5Ni7.5 (x = 15, 30 at.%) alloys. For each grade, the increasing Cr content leads to a decrease of T-sol and T-liq temperatures. It is also noted that there is an approximate 100 degrees C of undercooling exists in each grade during the solidification. The stable oxide inclusion in the Co85-xCrxMn7.5Ni7.5 and Co77.5-xCrxFe7.5Mn7.5Ni7.5 alloys is the MnCr2O4 type, while Cr2O3 is the main stable inclusion in the Co85-xCrxFe7.5Ni7.5 alloy. Furthermore, the size range of the MnCr2O4 particles is larger than that of Cr2O3. The theoretical calculation shows that MnCr2O4 has a higher coagulation coefficient than Cr2O3 does. This is due to the influence of the thermo-physical parameters, i.e. the interfacial energy between the oxide and the alloy and the viscosity of liquid alloy. The theoretical calculation fits well with the experimental findings.

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Added entries (persons, corporate bodies, meetings, titles ...)

  • Wang, YongKTH,Processer,Hanyang Univ, Dept Mat Sci & Chem Engn, Ansan 15588, South Korea.(Swepub:kth)u1msab4o (author)
  • Mu, Wangzhong,Dr.1985-KTH,Strukturer,Northeastern Univ, Sch Met, Key Lab Electromagnet Proc Mat, Minist Educ, Shenyang 110819, Peoples R China.(Swepub:kth)u1o72emm (author)
  • Park, Joo HyunKTH,Processer,Hanyang Univ, Dept Mat Sci & Chem Engn, Ansan 15588, South Korea.(Swepub:kth)u139gpma (author)
  • Kong, HuiAnhui Univ Technol, Sch Met Engn, Maanshan 243002, Anhui, Peoples R China. (author)
  • Sukenaga, SoheiTohoku Univ, Inst Multidisciplinary Res Adv Mat, Aoba Ku, 2-1-1 Katahira, Sendai, Miyagi 9808577, Japan. (author)
  • Shibata, HiroyukiTohoku Univ, Inst Multidisciplinary Res Adv Mat, Aoba Ku, 2-1-1 Katahira, Sendai, Miyagi 9808577, Japan. (author)
  • Larsson, HenrikKTH,Strukturer,Thermo Calc Software, Råsundav 18, SE-16767 Solna, Sweden.(Swepub:kth)u1z5mmxu (author)
  • Mao, Huahai,1971-KTH,Strukturer,Thermo Calc Software, Råsundav 18, SE-16767 Solna, Sweden.(Swepub:kth)u1v302dc (author)
  • KTHMaterialvetenskap (creator_code:org_t)

Related titles

  • In:Materials & design: Elsevier BV2100264-12751873-4197

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