An in-plane phase-field ductile fracture model for orthotropic paperboard material

Tryding, Johan (author): Lund University,Lunds universitet,Hållfasthetslära,Institutionen för byggvetenskaper,Institutioner vid LTH,Lunds Tekniska Högskola,Solid Mechanics,Department of Construction Sciences,Departments at LTH,Faculty of Engineering, LTH,Tetra Pak AB

Ristinmaa, Matti (author): Lund University,Lunds universitet,Hållfasthetslära,Institutionen för byggvetenskaper,Institutioner vid LTH,Lunds Tekniska Högskola,LTH profilområde: Nanovetenskap och halvledarteknologi,LTH profilområden,Solid Mechanics,Department of Construction Sciences,Departments at LTH,Faculty of Engineering, LTH,LTH Profile Area: Nanoscience and Semiconductor Technology,LTH Profile areas,Faculty of Engineering, LTH

(creator_code:org_t)

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Abstract Subject headings

A phase-field ductile fracture formulation for orthotropic paperboard materials is proposed, based on an anisotropic, multi-surface elastoplastic model describing the in-plane behavior of paperboard. A variational statement for the finite-step elastoplastic problem is extended to include the variational description of Griffith-type brittle fracture by a phase-field gradient term. The interaction between plastic and fracture dissipation mechanisms is modeled by introducing a scalar modulation function, assuming plasticity driven damage growth. This function depends on a scalar measure of the plastic strain components in the material orthotropy frame. It modifies the fracture activation criterion in a non-variational fashion, resulting in a direction-dependent material strength against crack propagation. The model performance is assessed by comparing numerical simulations and experimental tests conducted in a climate-controlled laboratory.

By the author/editor: Marengo, Alessan ...; Perego, Umberto; Borgqvist, Eric; Tryding, Johan; Ristinmaa, Matti

About the subject

ENGINEERING AND TECHNOLOGY: ENGINEERING AND ...; and Mechanical Engin ...; and Applied Mechanic ...

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