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Effect of thermal a...
Effect of thermal ageing on the shear strength of lead-free solder joints
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Oliver, James (author)
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- Liu, Johan, 1960 (author)
- Chalmers tekniska högskola,Chalmers University of Technology
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(creator_code:org_t)
- 2000
- 2000
- English.
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In: Proceedings of the International Conference on ”Advanced Packaging Materials Processes, Properties and Interfaces”. ; , s. 152-157
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Subject headings
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Subject headings
- TEKNIK OCH TEKNOLOGIER -- Elektroteknik och elektronik (hsv//swe)
- ENGINEERING AND TECHNOLOGY -- Electrical Engineering, Electronic Engineering, Information Engineering (hsv//eng)
Publication and Content Type
- kon (subject category)
- ref (subject category)
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