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Substrate-Less Vertical Chip-to-Waveguide Transition for W-Band Array Antenna Integration

Albadalejo Lijarcio, Juan Luis, 1994 (author)
Chalmers tekniska högskola,Chalmers University of Technology
Vosoogh, Abbas (author)
Vassilev, Vessen, 1969 (author)
Chalmers tekniska högskola,Chalmers University of Technology
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Yang, Jian, 1960 (author)
Chalmers tekniska högskola,Chalmers University of Technology
Emanuelsson, Thomas (author)
Telefonaktiebolaget L M Ericsson,Ericsson
Andersson, Ingmar (author)
Telefonaktiebolaget L M Ericsson,Ericsson
Uz Zaman, Ashraf, 1975 (author)
Chalmers tekniska högskola,Chalmers University of Technology
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 (creator_code:org_t)
2023
2023
English.
In: 2023 17TH EUROPEAN CONFERENCE ON ANTENNAS AND PROPAGATION, EUCAP. - 2164-3342. - 9788831299077
  • Conference paper (peer-reviewed)
Abstract Subject headings
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  • This paper presents a vertical transition from a high permittivity GaAs MMIC to rectangular waveguide using bondwires as a coupling structure. The transition is advantageous for the direct integration of any off-the-shelf chip into a waveguide antenna since no modification of the GSG-pad or additional substrate is needed. An EBG structure consisting of pins is used for the packaging of the chip in order to avoid field propagation in undesired directions. The simulations results show that the reflection coefficient is lower than -10 dB and the average insertion loss is better than 0.5 dB from around 87 to 101 GHz (14% relative bandwidth).

Subject headings

NATURVETENSKAP  -- Fysik -- Atom- och molekylfysik och optik (hsv//swe)
NATURAL SCIENCES  -- Physical Sciences -- Atom and Molecular Physics and Optics (hsv//eng)
TEKNIK OCH TEKNOLOGIER  -- Elektroteknik och elektronik -- Kommunikationssystem (hsv//swe)
ENGINEERING AND TECHNOLOGY  -- Electrical Engineering, Electronic Engineering, Information Engineering -- Communication Systems (hsv//eng)
TEKNIK OCH TEKNOLOGIER  -- Elektroteknik och elektronik -- Annan elektroteknik och elektronik (hsv//swe)
ENGINEERING AND TECHNOLOGY  -- Electrical Engineering, Electronic Engineering, Information Engineering -- Other Electrical Engineering, Electronic Engineering, Information Engineering (hsv//eng)

Keyword

waveguide (WG) transition
integration
bondwire
gap waveguide
mm-wave
Monolithic Microwave Integrated Circuit (MMIC)
packaging
W-band
GaAs

Publication and Content Type

kon (subject category)
ref (subject category)

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