id:"swepub:oai:research.chalmers.se:1b28126a-b445-411a-b1ea-300ff752c83b"
Search: id:"swepub:oai:research.chalmers.se:1b28126a-b445-411a-b1ea-300ff752c83b" > Interface and inter...
- 1 of 1
- Previous record
- Next record
- To hitlist
Interface and interconnection stresses in electronic assemblies – A critical review of analytical solutions
-
- Wong, E. H. (author)
- Monash University,Nanyang Technological University
-
- Liu, Johan, 1960 (author)
- Chalmers tekniska högskola,Chalmers University of Technology
- (creator_code:org_t)
- Elsevier BV, 2017
- 2017
- English.
- In: Microelectronics and Reliability. - : Elsevier BV. - 0026-2714. ; 79, s. 206-220
- Research review (peer-reviewed)
Abstract
Subject headings
Close
- The closed-form solutions for the interfacial stresses in assemblies constituting of two relatively stiff adherends sandwiching a relatively compliant adhesive layer are reviewed. The closed-form solutions are categorised into the “non-free edge solutions” that do not satisfy the nil-shear stress condition at the free edge of the adhesive and the “free edge solutions” that do. Being strength of material solutions, the non-free edge solutions are significantly simpler in form. On the other hand, the solutions tend to grossly underestimate the magnitude of the peeling stress at the free edge. Almost all classical “non-free edge solutions” suffer from two setbacks: (i) assumed ?a = 0, thus severely underestimating the magnitude of the peeling stress; and (ii) neglected the thickness of the adhesive in their formulation of the x-compliance of assemblies and the evaluation of the effective bending strain on adherends; the former leads to overestimation while the latter leads to gross underestimation of the shear stress (and hence, ?a(l)). These are demonstrated in a numerical exercise in which two widely followed “non-free edge solutions” and a simplified “free edge solutions” are benchmarked against the finite element analysis.
Subject headings
- TEKNIK OCH TEKNOLOGIER -- Elektroteknik och elektronik (hsv//swe)
- ENGINEERING AND TECHNOLOGY -- Electrical Engineering, Electronic Engineering, Information Engineering (hsv//eng)
Keyword
- Interfacial stresses
- Solder joints
- Bonded joints
- Sandwich assemblies
- Closed form
- Free edge
Publication and Content Type
- for (subject category)
- ref (subject category)
Find in a library
- Microelectronics and Reliability (Search for host publication in LIBRIS)
To the university's database
- 1 of 1
- Previous record
- Next record
- To hitlist
Find more in SwePub
- By the author/editor
- Wong, E. H.
- Liu, Johan, 1960
- About the subject
-
- ENGINEERING AND TECHNOLOGY
- ENGINEERING AND ...
- and Electrical Engin ...
- Articles in the publication
- Microelectronics ...
- By the university
- Chalmers University of Technology
Search outside SwePub
- Extend your search to:
- Google Book Search
- Google Scholar
Kungliga biblioteket hanterar dina personuppgifter i enlighet med EU:s dataskyddsförordning (2018), GDPR. Läs mer om hur det funkar här.
Så här hanterar KB dina uppgifter vid användning av denna tjänst.
- Copyright © LIBRIS - National Library Systems
- LIBRIS.kb.se
