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Through-Silicon Via...
Through-Silicon Vias Filled With Densified and Transferred Carbon Nanotube Forests
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- Jeppson, Kjell, 1947 (author)
- Chalmers tekniska högskola,Chalmers University of Technology
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- Wang, Teng, 1983 (author)
- Chalmers tekniska högskola,Chalmers University of Technology
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- Jiang, Di, 1983 (author)
- Chalmers tekniska högskola,Chalmers University of Technology
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- Ye, Lilei, 1970 (author)
- Chalmers tekniska högskola,Chalmers University of Technology
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- Liu, Johan, 1960 (author)
- Chalmers tekniska högskola,Chalmers University of Technology
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(creator_code:org_t)
- 2012
- 2012
- English.
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In: IEEE Electron Device Letters. - 0741-3106 .- 1558-0563. ; 33:3, s. 420-422
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Abstract
Subject headings
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- Through-silicon vias (TSVs) filled with densified and transferred carbon nanotube (CNT) forests are experimentally demonstrated. The filling is achieved by a postgrowth low-temperature transfer process at 200oC instead of direct CNT growth in the vias normally requiring high temperature. A vapor densification method is also applied to densify the as-grown CNT forests, which allows for packing more CNTs in the vias to reduce their resistances. CNT-filled TSVs fabricated based on these two key steps show CMOS compatibility and roughly one order of magnitude reduction in resistivity compared to the TSVs filled with as-grown undensified CNT forests.
Subject headings
- TEKNIK OCH TEKNOLOGIER -- Elektroteknik och elektronik (hsv//swe)
- ENGINEERING AND TECHNOLOGY -- Electrical Engineering, Electronic Engineering, Information Engineering (hsv//eng)
- TEKNIK OCH TEKNOLOGIER -- Elektroteknik och elektronik -- Annan elektroteknik och elektronik (hsv//swe)
- ENGINEERING AND TECHNOLOGY -- Electrical Engineering, Electronic Engineering, Information Engineering -- Other Electrical Engineering, Electronic Engineering, Information Engineering (hsv//eng)
Keyword
- carbon nanotubes
- 3D integration
- through-silicon-vias
Publication and Content Type
- art (subject category)
- ref (subject category)
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- By the author/editor
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Jeppson, Kjell, ...
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Wang, Teng, 1983
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Jiang, Di, 1983
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Ye, Lilei, 1970
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Liu, Johan, 1960
- About the subject
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- ENGINEERING AND TECHNOLOGY
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ENGINEERING AND ...
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and Electrical Engin ...
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- ENGINEERING AND TECHNOLOGY
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ENGINEERING AND ...
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and Electrical Engin ...
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and Other Electrical ...
- Articles in the publication
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IEEE Electron De ...
- By the university
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Chalmers University of Technology