Sökning: id:"swepub:oai:research.chalmers.se:5156233b-45ee-4ec0-a257-70fc8cc9214e" >
Optimized cleaning ...
Optimized cleaning processes for silicon wafer bonding
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Ljungberg, Karin (författare)
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- Bengtsson, Stefan, 1961 (författare)
- Chalmers tekniska högskola,Chalmers University of Technology
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(creator_code:org_t)
- 1996
- 1996
- Engelska.
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Ingår i: Proceedings of the Third International Symposium on Ultra Clean Processing of Silicon Surfaces. UCPSS '96. ; , s. 123-
- Relaterad länk:
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https://research.cha...
Abstract
Ämnesord
Stäng
- The use of SPFM (H2SO4-H2O2-HF) at low HF concentrations (10-1000 ppm) has been investigated as a pre-cleaning procedure for silicon direct bonding. This cleaning procedure can be tuned to simultaneously give hydrophilic surface properties, ensuring good bondability, and excellent electric properties, crucial for the application of direct bonding in device applications
Ämnesord
- TEKNIK OCH TEKNOLOGIER -- Elektroteknik och elektronik -- Annan elektroteknik och elektronik (hsv//swe)
- ENGINEERING AND TECHNOLOGY -- Electrical Engineering, Electronic Engineering, Information Engineering -- Other Electrical Engineering, Electronic Engineering, Information Engineering (hsv//eng)
Nyckelord
- integrated circuit reliability
- integrated circuit measurement
- surface contamination
- integrated circuit testing
- optimisation
- silicon
- wafer bonding
- elemental semiconductors
- surface cleaning
- integrated circuit yield
Publikations- och innehållstyp
- kon (ämneskategori)
- ref (ämneskategori)