Electroless Deposition of 4 μm High Ni/Au Bumps for 8 μm Pitch Interconnection

Sun, Jie, 1977 (author): Chalmers tekniska högskola,Chalmers University of Technology,Fuzhou University

(creator_code:org_t)

2022-10-04
2022
English.
In: ACS Applied Electronic Materials. - : American Chemical Society (ACS). - 2637-6113. ; 4:10, s. 4966-4971

Related links:: https://research.cha...; show more...; https://doi.org/10.1...; show less...

Abstract Subject headings

We propose that electroless plating is a superb approach to preparing metallic bumps with an ultrafine pitch for the integration of a micro light-emitting diode (micro-LED). Electroless plating does not suffer from lift-off-related issues, which are ubiquitous in thermal evaporation. Besides, it can result in much more uniform bumps than electroplating because the bump height is not affected by the current distribution. This study reports ultrafine pitch Ni/Au bumps fabricated by electroless nickel immersion gold (ENIG) plating. Furthermore, cheap metals iron and nickel are selected to catalyze the electroless nickel process. The results indicate that uniform and consistent Ni/Au bumps can be obtained through the iron sheet and nickel layer method. Besides, no voids and impurities are found inside the bumps, which is beneficial for the following interconnection process. Moreover, the change in Ni bump height values with the electroless plating time is also provided.

NATURVETENSKAP -- Fysik -- Annan fysik (hsv//swe)
NATURAL SCIENCES -- Physical Sciences -- Other Physics Topics (hsv//eng)
TEKNIK OCH TEKNOLOGIER -- Materialteknik -- Metallurgi och metalliska material (hsv//swe)
ENGINEERING AND TECHNOLOGY -- Materials Engineering -- Metallurgy and Metallic Materials (hsv//eng)
NATURVETENSKAP -- Fysik -- Den kondenserade materiens fysik (hsv//swe)
NATURAL SCIENCES -- Physical Sciences -- Condensed Matter Physics (hsv//eng)

By the author/editor: Tian, Liang; Lin, Chang; Pan, Kui; Lu, Yu; Deng, Liying; Huang, Zhonghang; show more...; Yang, Tianxi; Zhang, Yongai; Sun, Jie, 1977; Yan, Qun; show less...

About the subject

NATURAL SCIENCES: NATURAL SCIENCES; and Physical Science ...; and Other Physics To ...

ENGINEERING AND TECHNOLOGY: ENGINEERING AND ...; and Materials Engine ...; and Metallurgy and M ...

NATURAL SCIENCES: NATURAL SCIENCES; and Physical Science ...; and Condensed Matter ...

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