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Effect of Fiber Concentration on Mechanical and Thermal Properties of a Solder Matrix Fiber Composite Thermal Interface Material
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- Hansson, Josef, 1991 (author)
- Chalmers tekniska högskola,Chalmers University of Technology
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- Nilsson, Torbjörn, 1962 (author)
- Chalmers tekniska högskola,Chalmers University of Technology
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- Ye, L. (author)
- SHT Smart High-Tech AB
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- (creator_code:org_t)
- 2019
- 2019
- English.
- In: IEEE Transactions on Components, Packaging and Manufacturing Technology. - 2156-3985 .- 2156-3950. ; 9:6, s. 1045-1053
- Journal article (peer-reviewed)
Abstract
Subject headings
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- Increased demand on the mechanical and thermal properties on the thermal interface and die attach material creates a demand for materials with tailored material properties. Solder matrix fiber composites (SMFCs) have been shown to address these challenges, but have, so far, required complicated procedures and components. In this paper, we present the fabrication of a new type of SMFC based on commercially available fiber networks infiltrated with Sn-Ag-Cu alloy (SAC305) or indium using equipment for large-volume production. The composite material exhibits similar thermal properties compared to pure solder, and mechanical properties that can be tailored toward specific applications. We also show that the handling properties of the SMFC allows it to be used in process flows where multiple reflow cycles are required and can achieve a well-defined bond line thickness (BLT) and good bonding using fluxless reflow under pressure.
Subject headings
- TEKNIK OCH TEKNOLOGIER -- Kemiteknik -- Polymerteknologi (hsv//swe)
- ENGINEERING AND TECHNOLOGY -- Chemical Engineering -- Polymer Technologies (hsv//eng)
- TEKNIK OCH TEKNOLOGIER -- Materialteknik -- Textil-, gummi- och polymermaterial (hsv//swe)
- ENGINEERING AND TECHNOLOGY -- Materials Engineering -- Textile, Rubber and Polymeric Materials (hsv//eng)
- TEKNIK OCH TEKNOLOGIER -- Materialteknik -- Kompositmaterial och -teknik (hsv//swe)
- ENGINEERING AND TECHNOLOGY -- Materials Engineering -- Composite Science and Engineering (hsv//eng)
Keyword
- thermal management
- Bond line thickness (BLT) control
- thermal interface materials (TIMs)
- solder
- die attach
Publication and Content Type
- art (subject category)
- ref (subject category)
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