Sökning: id:"swepub:oai:research.chalmers.se:aa94223f-d2e7-49f1-aa05-0c4d782da160" > Effect of Fiber Con...
Fältnamn | Indikatorer | Metadata |
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000 | 03232naa a2200409 4500 | |
001 | oai:research.chalmers.se:aa94223f-d2e7-49f1-aa05-0c4d782da160 | |
003 | SwePub | |
008 | 190621s2019 | |||||||||||000 ||eng| | |
024 | 7 | a https://doi.org/10.1109/TCPMT.2019.29136902 DOI |
024 | 7 | a https://research.chalmers.se/publication/5109052 URI |
040 | a (SwePub)cth | |
041 | a engb eng | |
042 | 9 SwePub | |
072 | 7 | a art2 swepub-publicationtype |
072 | 7 | a ref2 swepub-contenttype |
100 | 1 | a Hansson, Josef,d 1991u Chalmers tekniska högskola,Chalmers University of Technology4 aut0 (Swepub:cth)josefha |
245 | 1 0 | a Effect of Fiber Concentration on Mechanical and Thermal Properties of a Solder Matrix Fiber Composite Thermal Interface Material |
264 | 1 | c 2019 |
520 | a Increased demand on the mechanical and thermal properties on the thermal interface and die attach material creates a demand for materials with tailored material properties. Solder matrix fiber composites (SMFCs) have been shown to address these challenges, but have, so far, required complicated procedures and components. In this paper, we present the fabrication of a new type of SMFC based on commercially available fiber networks infiltrated with Sn-Ag-Cu alloy (SAC305) or indium using equipment for large-volume production. The composite material exhibits similar thermal properties compared to pure solder, and mechanical properties that can be tailored toward specific applications. We also show that the handling properties of the SMFC allows it to be used in process flows where multiple reflow cycles are required and can achieve a well-defined bond line thickness (BLT) and good bonding using fluxless reflow under pressure. | |
650 | 7 | a TEKNIK OCH TEKNOLOGIERx Kemiteknikx Polymerteknologi0 (SwePub)204032 hsv//swe |
650 | 7 | a ENGINEERING AND TECHNOLOGYx Chemical Engineeringx Polymer Technologies0 (SwePub)204032 hsv//eng |
650 | 7 | a TEKNIK OCH TEKNOLOGIERx Materialteknikx Textil-, gummi- och polymermaterial0 (SwePub)205042 hsv//swe |
650 | 7 | a ENGINEERING AND TECHNOLOGYx Materials Engineeringx Textile, Rubber and Polymeric Materials0 (SwePub)205042 hsv//eng |
650 | 7 | a TEKNIK OCH TEKNOLOGIERx Materialteknikx Kompositmaterial och -teknik0 (SwePub)205022 hsv//swe |
650 | 7 | a ENGINEERING AND TECHNOLOGYx Materials Engineeringx Composite Science and Engineering0 (SwePub)205022 hsv//eng |
653 | a thermal management | |
653 | a Bond line thickness (BLT) control | |
653 | a thermal interface materials (TIMs) | |
653 | a solder | |
653 | a die attach | |
700 | 1 | a Nilsson, Torbjörn,d 1962u Chalmers tekniska högskola,Chalmers University of Technology4 aut0 (Swepub:cth)tornilss |
700 | 1 | a Ye, L.u SHT Smart High-Tech AB4 aut |
700 | 1 | a Liu, Johan,d 1960u Chalmers tekniska högskola,Chalmers University of Technology4 aut0 (Swepub:cth)jliu |
710 | 2 | a Chalmers tekniska högskolab SHT Smart High-Tech AB4 org |
773 | 0 | t IEEE Transactions on Components, Packaging and Manufacturing Technologyg 9:6, s. 1045-1053q 9:6<1045-1053x 2156-3985x 2156-3950 |
856 | 4 8 | u https://doi.org/10.1109/TCPMT.2019.2913690 |
856 | 4 8 | u https://research.chalmers.se/publication/510905 |
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