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Thick film patterning by lift-off process using double-coated single photoresists
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- Fu, Yifeng, 1984 (author)
- Chalmers tekniska högskola,Chalmers University of Technology
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- Ye, L. (author)
- SHT Smart High-Tech AB
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- Liu, Johan, 1960 (author)
- Chalmers tekniska högskola,Chalmers University of Technology
- (creator_code:org_t)
- Elsevier BV, 2012
- 2012
- English.
- In: Materials Letters. - : Elsevier BV. - 1873-4979 .- 0167-577X. ; 76, s. 117-119
- Journal article (peer-reviewed)
Abstract
Subject headings
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- A novel method using lift-off process for patterning very thick materials is developed and demonstrated. Unlike conventional lift-off processes, no special lift-off resist is used in this method. Instead, only a double-coated single photoresist is needed. Demonstrations using two commercial photoresists show that good patterning morphology and obvious undercuts as high as 15 mu m are obtained for lift-off, which is very difficult to achieve by existing methods. The application and feasibility of this approach is demonstrated by a carbon nanotube transfer process. This simple and effective method offers wider option to pattern very thick materials in high quality which are in strong demands.
Subject headings
- NATURVETENSKAP -- Fysik (hsv//swe)
- NATURAL SCIENCES -- Physical Sciences (hsv//eng)
Keyword
- Double-coated photoresist
- Thick film deposition
- mems
- scale
- transducer
- Lift-off
- deposition
- low-temperature
Publication and Content Type
- art (subject category)
- ref (subject category)
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