Graphene Based Heat Spreader for High Power Chip Cooling Using Flip-chip Technology

Zhang, Yong, 1982 (author): Chalmers tekniska högskola,Chalmers University of Technology

Sun, Shuangxi, 1986 (author): Chalmers tekniska högskola,Chalmers University of Technology

Fu, Yifeng, 1984 (author): Chalmers tekniska högskola,Chalmers University of Technology

Liu, Johan, 1960 (author): Chalmers tekniska högskola,Chalmers University of Technology

(creator_code:org_t)

ISBN 9781479928330
2013
2013
English.
In: 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013). - 9781479928330 ; , s. 347-352

Related links:: https://research.cha...; show more...; https://doi.org/10.1...; show less...

Abstract Subject headings

Monolayer graphene was synthesized through thermal chemical vapor deposition (TCVD) as heat spreader for chip cooling. Platinum (Pt) serpentine functioned as hot spot on the thermal testing chip. The thermal testing chip with monolayer graphene film attached was bonded using flip-chip technology. The temperature at the hot spot with a monolayer graphene film as heat spreader was decreased by about 12°C and had a more uniform temperature compared to those without graphene heat spreader when driven by a heat flux of about 640W/cm 2 . Further improvements to the cooling performance of graphene heat spreader could be made by optimizing the synthesis parameters and transfer process of graphene films. © 2013 IEEE.

By the author/editor: Huang, Shirong; Zhang, Yong, 198 ...; Sun, Shuangxi, 1 ...; Fan, X.; Wang, Ling; Fu, Yifeng, 1984; show more...; Zhang, Yan; Liu, Johan, 1960; show less...

About the subject

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