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Manufacture, Microstructure and Microhardness Analysis of Sn-Bi Lead-Free Solder Reinforced with Sn-Ag-Cu Nano-particles
- Zhang, Lili (author)
- Tao, Wenkai (author)
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- Liu, Johan, 1960 (author)
- Chalmers tekniska högskola,Chalmers University of Technology
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- Zhang, Yan (author)
- Cheng, Zhaonian, 1942 (author)
- Gao, Yulai (author)
- Zhai, Qijie (author)
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- (creator_code:org_t)
- 2008
- 2008
- English.
- In: Proceedings of the 2008 International Conference on Electronics Packaging Technology & High Density Packaging. ; , s. E1-1 0
- Conference paper (peer-reviewed)
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- TEKNIK OCH TEKNOLOGIER -- Elektroteknik och elektronik (hsv//swe)
- ENGINEERING AND TECHNOLOGY -- Electrical Engineering, Electronic Engineering, Information Engineering (hsv//eng)
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