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Layer-by-layer 3D p...
Layer-by-layer 3D printing of Si micro- and nanostructures by Si deposition, ion implantation and selective Si etching
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- Fischer, Andreas C. (author)
- KTH,Mikrosystemteknik
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- Gylfason, Kristinn B., 1978- (author)
- KTH,Mikrosystemteknik
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Belova, Lyubov M. (author)
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- Malm, Gunnar B. (author)
- KTH,Integrerade komponenter och kretsar
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- Radamson, Henry H. (author)
- KTH,Integrerade komponenter och kretsar
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- Kolahdouz, M. (author)
- KTH,Integrerade komponenter och kretsar
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Rikers, Y. G. M. (author)
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- Stemme, Göran (author)
- KTH,Mikrosystemteknik
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- Niklaus, Frank (author)
- KTH,Mikrosystemteknik
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(creator_code:org_t)
- IEEE conference proceedings, 2012
- 2012
- English.
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In: 12th IEEE Conference on Nanotechnology (IEEE-NANO), 2012. - : IEEE conference proceedings. - 9781467321983 ; , s. 1-4
- Related links:
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http://dx.doi.org/10...
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https://kth.diva-por... (primary) (Raw object)
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https://urn.kb.se/re...
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https://doi.org/10.1...
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Abstract
Subject headings
Close
- In this paper we report a method for layer-by-layer printing of three-dimensional (3D) silicon (Si) micro- and nanostructures. This fabrication method is based on a sequence of alternating steps of chemical vapor deposition of Si and local implantation of gallium (Ga+) ions by focused ion beam (FIB) writing. The defined 3D structures are formed in a final step by selectively wet etching the non-implanted Si in potassium hydroxide (KOH). We demonstrate the viability of the method by fabricating 2 and 3-layer 3D Si structures, including suspended beams and patterned lines with dimensions on the nm-scale.
Subject headings
- TEKNIK OCH TEKNOLOGIER -- Elektroteknik och elektronik -- Annan elektroteknik och elektronik (hsv//swe)
- ENGINEERING AND TECHNOLOGY -- Electrical Engineering, Electronic Engineering, Information Engineering -- Other Electrical Engineering, Electronic Engineering, Information Engineering (hsv//eng)
Keyword
- 3D silicon patterning
- 3D Si printing
- focused ion beam (FIB) writing
- ion implantation
- microstructures
- nanostructures
- MEMS
- NEMS
Publication and Content Type
- ref (subject category)
- kon (subject category)
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