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Sökning: onr:"swepub:oai:DiVA.org:kth-21259" > Characterization of...

LIBRIS Formathandbok  (Information om MARC21)
FältnamnIndikatorerMetadata
00002711naa a2200361 4500
001oai:DiVA.org:kth-21259
003SwePub
008100810s2002 | |||||||||||000 ||eng|
024a https://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-212592 URI
024a https://doi.org/10.1016/S0168-583X(01)00879-52 DOI
040 a (SwePub)kth
041 a engb eng
042 9 SwePub
072 7a ref2 swepub-contenttype
072 7a art2 swepub-publicationtype
100a Keskitalo, N.4 aut
2451 0a Characterization of hydrophobic bonded silicon wafers
264 1c 2002
338 a print2 rdacarrier
500 a QC 20100525
520 a Direct bonding of silicon-to-silicon has been recognized as an interesting method for creating novel device geometries and structures and it has so far been used for the preparation of power devices and sensors. The influence of the bonded interface on electrical performance is then of great interest. In this contribution the interface region of hydrophobic bonded n-type silicon wafers have been studied and a comparison is made between samples before and after an exposure to low doses of 9.5 MeV protons to see the effect of the interface on point defect kinetics, The samples were studied using current-voltage (IV), capacitance-voltage (CV). deep level transient spectroscopy (DLTS). secondary ion mass spectrometry (SIMS) and scanning electron microscopy (SEM). During reverse bias there is a dramatic increase in leakage current when the depletion region reaches the bonded interface region. Due to the high leakage currents DLTS measurements could not be performed directly at the interface. However. in contrast to previous studies. no deep levels are discovered in the interface region of non-irradiated samples and, furthermore, no influence of the bonded interface on the concentration and depth distribution of irradiation induced defects could be detected. This suggests that the irradiation induced defects are unaffected by the bonded interlace, At the interface a boron peak is detected by SIMS.
653 a deep level
653 a bonded interface
653 a grain boundary
653 a proton-irradiated silicon
653 a interface
653 a boron
700a Tiensuu, S.4 aut
700a Hallén, Anders.u KTH,Mikroelektronik och informationsteknik, IMIT4 aut0 (Swepub:kth)u11ywmz1
710a KTHb Mikroelektronik och informationsteknik, IMIT4 org
773t Nuclear Instruments and Methods in Physics Research Section Bg 186, s. 66-70q 186<66-70x 0168-583Xx 1872-9584
8564 8u https://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-21259
8564 8u https://doi.org/10.1016/S0168-583X(01)00879-5

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Keskitalo, N.
Tiensuu, S.
Hallén, Anders.
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