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LIBRIS Formathandbok  (Information om MARC21)
FältnamnIndikatorerMetadata
00006791naa a2200565 4500
001oai:DiVA.org:kth-85415
003SwePub
008120213s1999 | |||||||||||000 ||eng|
0247 a https://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-854152 URI
040 a (SwePub)kth
041 a engb eng
042 9 SwePub
072 7a ref2 swepub-contenttype
072 7a art2 swepub-publicationtype
1001 a Hong, J.4 aut
2451 0a Plasma chemistries for high density plasma etching of SiC
264 1a Charlottesville, VA, USA,c 1999
338 a print2 rdacarrier
500 a References: Casady, J.B., Agarwal, A.K., Rowland, L.B., Seshadri, S., Siegiez, R.R., Mani, S.S., Sheridan, D.C., Brandt, C.D., (1998) Mater. Res. Soc. Symp. Proc., 483, p. 27. , Pittsburgh, PA: Mater. Res. Soc; Agarwal, A.K., Seshadri, S., Rowland, L.B., (1997) IEEE Electron Dev. Lett., 18, p. 592; Palmour, J.W., Edmond, J.A., Kong, H.S., Carter C.H., Jr., (1994) SiC and Related Materials, 137, p. 499. , Bristol, U.K.: Institute of Physics; Baliga, B.J., (1996) Power Semiconductor Devices, , Boston: PWS Publishing; Ueno, K., Asai, R., Tsuji, T., (1998) IEEE Electron Dev. Lett., EDL-19, p. 244; Spitz, J., Melloch, M.R., Cooper J.A., Jr., Capano, M., (1998) IEEE Electron. Dev. Lett., EDL-19, p. 100; Neudeck, P.G., (1995) J. Electron. Mater., 24, p. 283; Shenoy, J.N., Melloch, M.R., Cooper J.A., Jr., (1997) IEEE Electron. Dev. Lett., EDL-18, p. 93; Baliga, B.J., (1996) Inst. Phys. Conf. Ser., 142, p. 1. , Bristol, U.K.: Institute of Physics; Raghunathan, R., Baliga, B.J., (1998) IEEE Electron Dev. Lett., EDL-19, p. 71; Agarwal, A.K., Casady, J.B., Rowland, L.B., Valek, W.F., White, M.H., Brandt, C.D., (1997) IEEE Electron. Dev. Lett., EDL-18, p. 586; Konstantinov, A.O., Ivanov, P.V., Nordell, N., Karlsson, S., Harris, C.I., (1997) IEEE Electron. Dev. Lett., EDL-18, p. 521; Casady, J.B., Johnson, R.W., (1996) Solid-state Electron., 39, p. 1409; Weitzel, C.E., Moore, K.E., (1998) J. Electron. Mater., 27, p. 365; Capano, M.A., Trew, R.J., (1997) MRS Bulletin, 22, p. 19; Shor, J.S., Kurtz, A.D., Grimberg, I., Weiss, B.Z., Osgood, R.M., (1997) J. Appl. Phys., 81, p. 1546; Collins, D.H., Harris, G.L., Wongchotigul, K., Zhang, D., Chen, N., Taylor, C., (1996) Inst. Phys. Conf. Ser., 142, p. 617. , Bristol, U.K.: Institute of Physics; Yih, P.H., Steckl, A.J., (1995) J. Electrochem. Soc., 142, p. 312; Casady, J.B., Luckowski, E.D., Bozack, M., Sheridan, D., Johnson, R.W., Williams, J.H., (1996) J. Electrochem. Soc., 143, p. 750; Steckl, A.J., Yih, P.H., (1992) Appl. Phys. Lett., 60, p. 1966; Casady, J.B., Luckowski, E.D., Bozack, M., Sheridan, D., Johnson, R.W., Williams, J.H., (1996) Inst. Phys. Conf. Ser., 142, p. 625. , Bristol, U.K.: Institute of Physics; Luther, B.P., Ruzyllo, J., Miller, D.L., (1993) Appl. Phys. Lett., 63, p. 171; Lavois, F., Lassagne, P., Locabelli, M.L., (1996) Appl. Phys. Lett., 69, p. 236; Sadiyath, R., Wright, R.L., Chaudry, M.I., Babu, S.V., (1991) Appl. Phys. Lett., 58, p. 1053; Wu, J., Darsons, J.D., Evans, D.R., (1995) J. Electrochem. Soc., 142, p. 669; Cao, L., Li, B., Zhao, J.H., (1997) SiC and Related Compounds Conf. Stockholm, , Sweden; Wang, J.J., Lambers, E.S., Pearton, S.J., Östling, M., Zetterling, C.-M., Grow, J.M., Ren, F., (1998) Solid-state Electron., 42, p. 743; Flemish, J.R., Xie, K., Zhao, J., (1994) Appl. Phys. Lett., 64, p. 2315; Flemish, J.R., Xie, K., Buchwald, W., Casas, L., Zhao, J.H., McLane, G.F., Dubey, M., (1994) Mater. Res. Soc. Sump. Proc., 339, p. 145. , Pittsburgh, PA: Mater. Res. Soc; Flemish, J.R., Xie, K., (1996) J. Electrochem. Soc., 143, p. 2620; Xie, K., Flemish, J.R., Zhao, J.H., Buchwald, W.R., Casas, L., (1995) Appl. Phys. Lett., 67, p. 368; McDaniel, G.F., Lee, J.W., Lambers, E.S., Pearton, S.J., Holloway, P.H., Ren, F., Grow, J.M., Wilson, R.G., (1997) J. Vac. Sci. Technol. A, 14, p. 885; Flemish, J.R., Xie, K., McLane, G.F., (1996) Mater. Res. Soc. Symp. Proc., 421, p. 153. , Pittsburgh, PA: Mater. Res. Soc; Ren, F., Grow, J.M., Bhaskaran, M., Lee, J.W., Vartuli, C.B., Lothian, J.R., Flemish, J.R., (1996) Mater. Res. Soc. Symp. Proc., 421, p. 251. , Pittsburgh, PA: Mater. Res. Soc; Wang, J.J., Lambers, E.S., Pearton, S.J., Östling, M., Zetterling, C.-M., Grow, J.M., Ren, F., Shul, R.J., (1998) J. Vac. Sci. Technol. A, 16, p. 2605 NR 20140805
520 a A variety of different plasma chemistries, including SF6, Cl2, ICI, and IBr, have been examined for dry etching of 6H-SiC in high ion density plasma tools (inductively coupled plasma and electron cyclotron resonance). Rates up to 4500 angstroms·min-1 were obtained for SF6 plasmas, while much lower rates (≀800 angstroms·min-1) were achieved with Cl2, ICI, and IBr. The F2-based chemistries have poor selectivity for SiC over photoresist masks (typically 0.4-0.5), but Ni masks are more robust, and allow etch depths ≥10 ÎŒm in the SiC. A micromachining process (sequential etch/deposition steps) designed for Si produces relatively low etch rates (<2,000 angstroms·min-1) for SiC.
650 7a TEKNIK OCH TEKNOLOGIERx Elektroteknik och elektronikx Annan elektroteknik och elektronik0 (SwePub)202992 hsv//swe
650 7a ENGINEERING AND TECHNOLOGYx Electrical Engineering, Electronic Engineering, Information Engineeringx Other Electrical Engineering, Electronic Engineering, Information Engineering0 (SwePub)202992 hsv//eng
653 a Chlorine
653 a Electron cyclotron resonance
653 a Fluorine compounds
653 a Iodine compounds
653 a Masks
653 a Micromachining
653 a Photoresists
653 a Plasma density
653 a Plasma etching
653 a Silicon carbide
653 a Inductively coupled plasma
653 a Plasma chemistry
653 a Sulfur hexafluoride
653 a Semiconducting silicon compounds
7001 a Shul, R. J.4 aut
7001 a Zhang, L.4 aut
7001 a Lester, L. F.4 aut
7001 a Cho, H.4 aut
7001 a Hahn, Y. B.4 aut
7001 a Hays, D. C.4 aut
7001 a Jung, K. B.4 aut
7001 a Pearton, S. J.4 aut
7001 a Zetterling, Carl-Mikaelu KTH,Integrerade komponenter och kretsar4 aut0 (Swepub:kth)u15o61ns
7001 a Östling, Mikaelu KTH,Integrerade komponenter och kretsar4 aut0 (Swepub:kth)u1u0kle4
7102 a KTHb Integrerade komponenter och kretsar4 org
7730 t Journal of Electronic Materialsd Charlottesville, VA, USAg 28:3, s. 196-201q 28:3<196-201x 0361-5235x 1543-186X
8564 u http://www.scopus.com/inward/record.url?eid=2-s2.0-0032664895&partnerID=40&md5=1bb7e62bd8dd2fe8665da9094ace3fce
8564 8u https://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-85415

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