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On the ion implantation of phosphorus as a method for the passivation of states at the interface between 4H-SiC and SiO2 produced by thermal oxidation in dry oxygen

Mikhaylov, Aleksey I. (author)
St. Petersburg State Electrotechnical University LETI, Russia
Afanasiev, A. V. (author)
St. Petersburg State Electrotechnical University LETI, Russia
Ilyin, V. A. (author)
St. Petersburg State Electrotechnical University LETI, Russia
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Luchinin, Victor Victorovich (author)
St. Petersburg State Electrotechnical University LETI, Russia
Reshanov, Sergey A. (author)
Ascatron AB, Sweden
Krieger, Michael (author)
Friedrich-Alexander-Universität Erlangen-Nurnberg, Germany
Schöner, Adolf (author)
RISE,Acreo,Ascatron AB, Sweden
Sledziewski, Tomasz (author)
Friedrich-Alexander-Universität Erlangen-Nurnberg, Germany
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St Petersburg State Electrotechnical University LETI, Russia Ascatron AB, Sweden (creator_code:org_t)
Maik Nauka-Interperiodica Publishing, 2014
2014
English.
In: Semiconductors (Woodbury, N.Y.). - : Maik Nauka-Interperiodica Publishing. - 1063-7826 .- 1090-6479. ; 48:12, s. 1581-1585
  • Journal article (peer-reviewed)
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  • A method is suggested for reducing the density of surface states at the 4H-SiC/SiO2 interface by the implantation of phosphorus ions into a 4H-SiC epitaxial layer immediately before the growth of a gate insulator in an atmosphere of dry oxygen. A significant decrease in the density of surface states is observed at a phosphor-ion concentration at the SiO2/SiC interface exceeding 1018 cm−3. However, together with the passivation of surface states, the introduction of phosphorus ions leads to an increase in the built-in charge in the insulator and also slightly deteriorates the reliability of the gate insulator fabricated by this technique.

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