L773:1084 6999 OR L773:9781424496327
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New Wafer-Level Fabrication of Ultrathin Silicon Insertion Shuttles for Flexible Neural Implants
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- Sharma, Kirti (author)
- Albert-Ludwigs-Universität Freiburg,University of Freiburg
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- Boehler, Christian (author)
- Albert-Ludwigs-Universität Freiburg,University of Freiburg
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- Asplund, Maria, 1978 (author)
- Albert-Ludwigs-Universität Freiburg,University of Freiburg,Chalmers tekniska högskola,Chalmers University of Technology
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- (creator_code:org_t)
- 2023
- 2023
- English.
- In: Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS). - 1084-6999. ; 2023-January, s. 421-424
- Conference paper (peer-reviewed)
Abstract
Subject headings
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- This paper reports a novel, cost-effective process for the fabrication of ultrathin silicon (Si) shuttles applied as insertion tools for highly flexible polyimide (PI) neural implants. The process exploits the so-called etching before grinding (EBG) process established to realize Si-based neural probes of the Michigan style. In this study, EBG is combined for the first time with a subsequent deep reactive ion etch (DRIE) process applied on the wafer-level. The innovative approach allows to realize insertion shuttles with a base thickness > 50 μm using wafer grinding and to reliably thin down the slender shuttle shanks (width ≥ 35 μm) to thicknesses as small as 15 μm using DRIE. The backgrinding liquid wax applied during wafer grinding enables the safe release of the delicate shuttle structures from their carrier wafer using isopropanol. Flexible, 15-μm-thin neural probes made from PI are precisely aligned and temporarily bonded to the custom-designed insertion shuttles applying polyethylene glycol (PEG) and reliably deployed into cortical tissue.
Subject headings
- TEKNIK OCH TEKNOLOGIER -- Maskinteknik -- Produktionsteknik, arbetsvetenskap och ergonomi (hsv//swe)
- ENGINEERING AND TECHNOLOGY -- Mechanical Engineering -- Production Engineering, Human Work Science and Ergonomics (hsv//eng)
- TEKNIK OCH TEKNOLOGIER -- Maskinteknik -- Annan maskinteknik (hsv//swe)
- ENGINEERING AND TECHNOLOGY -- Mechanical Engineering -- Other Mechanical Engineering (hsv//eng)
- TEKNIK OCH TEKNOLOGIER -- Maskinteknik -- Tillförlitlighets- och kvalitetsteknik (hsv//swe)
- ENGINEERING AND TECHNOLOGY -- Mechanical Engineering -- Reliability and Maintenance (hsv//eng)
Keyword
- grinding
- polyimide probes
- ultrathin chips
- Silicon thinning
- self-alignment
- ultrathin probes
- silicon shuttles
- backgrinding liquid wax
Publication and Content Type
- kon (subject category)
- ref (subject category)
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