Characterization of crack-free relaxed GaN grown on 2″ sapphire

• We demonstrate the growth of high-quality and virtually strain-free bulklike GaN by hydride vapor-phase epitaxy in a vertical atmospheric-pressure reactor with a bottom-fed design. The 300‐μm-thick GaN layer was grown on a 2″ (0 0 0 1) sapphire substrate buffered with a ∼ 2‐μm-thick GaN layer grown by metal-organic chemical-vapor deposition. During the cool down process to room temperature, cracking was induced in the sapphire substrate, thereby allowing the bulklike GaN layer to relax without provoking cracking of itself. The crystalline quality and the residual strain in the 2″ GaN wafer were investigated by various characterization techniques. The lateral homogeneity of the wafer was monitored by low-temperature photoluminescence mapping. High-resolution x-ray diffraction and photoluminescence measurements proved the high crystalline quality of the material grown. The position of the main near-band-gap photoluminescence line and the phonon spectra obtained from infrared spectroscopic ellipsometry show consistently that the 2″ crack-free GaN is virtually strain-free over a diameter of approximately 4 cm.

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