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Evolution of aluminide coating microstructure on nickel-base cast superalloy CM-247 in a single-step high-activity aluminizing process

Das, O. K. (författare)
Singh, V. (författare)
Joshi, S. V. (författare)
1998
1998
Engelska.
Ingår i: Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science. ; 29:8, s. 2173-2188
  • Tidskriftsartikel (refereegranskat)
Abstract Ämnesord
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  • This study deals with the aluminizing of a directionally cast Ni-base superalloy, namely CM-247, by a single-step process using a high-activity pack. It is observed that significant incorporation of Al into the substrate surface during aluminizing continues over a period of about 1 hour and is not restricted merely to the first few minutes, as reported in the literature. Based on the microstructural details of the coatings formed at various stages of aluminizing, it is concluded that the coating growth in the above process takes place primarily by inward Al diffusion initially, followed by an intermediate stage when the growth involves both inward Al and outward Ni diffusion. In the final stages, the outward diffusion of Ni dominates the coating formation process. The above mechanism of coating formation is different from the one that prevails in the conventional two-step high-activity coating process in that the reaction front for the formation of NiAl remains spatially stationary despite the outward diffusion of nickel during the intermediate stage. It is also shown in the present study that the content of the Al source in the pack affects the coating structure significantly. It is further demonstrated that the microstructure of the aluminide coatings depends not only on the amount of Al incorporated in the sample during aluminizing but also on the time over which the uptake of this Al takes place.

Nyckelord

Aluminum
Composition effects
Diffusion in solids
Growth (materials)
Metallographic microstructure
Protective coatings
Superalloys
Aluminizing
Superalloy CM-247
Nickel alloys

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Das, O. K.
Singh, V.
Joshi, S. V.
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