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Search: (LAR1:liu) pers:(Syväjärvi Mikael) > (2015-2019) > Silicon Carbide Sur...

Silicon Carbide Surface Cleaning and Etching

Jokubavicius, Valdas, 1983- (author)
Linköpings universitet,Halvledarmaterial,Tekniska fakulteten
Syväjärvi, Mikael, 1968- (author)
Linköpings universitet,Halvledarmaterial,Tekniska fakulteten
Yakimova, Rositsa, 1942- (author)
Linköpings universitet,Halvledarmaterial,Tekniska fakulteten
 (creator_code:org_t)
2018-07-25
2018
English.
In: Advancing Silicon Carbide Electronics Technology I. - : Materials Research Forum LLC. - 9781945291845 - 9781945291852 ; , s. 1-26
  • Book chapter (peer-reviewed)
Abstract Subject headings
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  • Silicon carbide (SiC) surface cleaning and etching (wet, electrochemical, thermal) are important technological processes in preparation of SiC wafers for crystal growth, defect analysis or device processing. While removal of organic, particulate and metallic contaminants by chemical cleaning is a routine process in research and industrial production, the etching which, in addition to structural defects analysis, can also be used to modify wafer surface structure, is very interesting for development of innovative device concepts. In this book chapter we review SiC chemical cleaning and etching procedures and present perspectives of SiC etching for new device development.

Keyword

Silicon Carbide
Chemical Cleaning
Wet Etching
Electrochemical Etching
Porous SiC

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