Germanium "hexa" detector : Production and testing

• Here we present new result on the testing of a Germanium sensor for X-ray radiation. The system is made of 3 × 2 Medipix3RX chips, bump-bonded to a monolithic sensor, and is called "hexa". Its dimensions are 45 × 30 mm2 and the sensor thickness was 1.5 mm. The total number of the pixels is 393216 in the matrix 768 × 512 with pixel pitch 55 μ m. Medipix3RX read-out chip provides photon counting read-out with single photon sensitivity. The sensor is cooled to -126°C and noise levels together with flat field response are measured. For -200 V polarization bias, leakage current was 4.4 mA (3.2 μ A/mm2). Due to higher leakage around 2.5% of all pixels stay non-responsive. More than 99% of all pixels are bump bonded correctly. In this paper we present the experimental set-up, threshold equalization procedure, image acquisition and the technique for bump bond quality estimate.

Ämnesord

NATURVETENSKAP  -- Fysik -- Acceleratorfysik och instrumentering (hsv//swe)

NATURAL SCIENCES  -- Physical Sciences -- Accelerator Physics and Instrumentation (hsv//eng)

Nyckelord

Hybrid detectors

Materials for solid-state detectors

Solid state detectors

X-ray detectors

Publikations- och innehållstyp

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