Low temperature adhesive wafer bonding using OSTE(+) for heterogeneous 3D MEMS integration

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IEEE conference proceedings, 2013
2013
Engelska.
Ingår i: Micro Electro Mechanical Systems (MEMS), 2013 IEEE 26th International Conference on. - : IEEE conference proceedings. - 9781467356541 ; , s. 342-346

Relaterad länk:: http://www.mems2013....; visa fler...; http://ieeexplore.ie...; https://kth.diva-por... (primary) (Raw object); https://urn.kb.se/re...; https://doi.org/10.1...; visa färre...

Abstract Ämnesord

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We demonstrate, for the first time, the use of off stoichiometry thiolene-epoxy, OSTE(+) for adhesive wafer bonding. The dual cure system, with an initial UV-curing step followed by a second thermal cure, allows for high bond strength and potentially high quality material interfaces. We show that cured OSTE(+) is easily removed in oxygen plasma and that the characteristics of OSTE(+) make it a potential candidate for use in heterogeneous 3D MEMS integration. Furthermore, we show how the bond energies of wafers bonded with OSTE(+) adhesive compares with the bond energies of wafers bonded with Cyclotene 3022-46 (BCB) and mr-I 9150XP nanoimprint resist.

Av författaren/redakt...: Forsberg, Fredri ...; Saharil, Farizah; Stemme, Göran; Roxhed, Niclas; van der Wijngaar ...; Haraldsson, Tomm ...; visa fler...; Niklaus, Frank; visa färre...

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