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Low Inductive SiC Power Electronics Module with Flexible PCB Interconnections and 3D Printed Casing
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- Akbari, Saeed (författare)
- RISE,Smart hårdvara
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- Kostov, Konstantin Stoychev (författare)
- RISE,Smart hårdvara
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- Brinkfeldt, Klas (författare)
- RISE,Smart hårdvara
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- (creator_code:org_t)
- Institute of Electrical and Electronics Engineers Inc. 2022
- 2022
- Engelska.
- Ingår i: 2022 IMAPS Nordic Conference on Microelectronics Packaging, NordPac 2022. - : Institute of Electrical and Electronics Engineers Inc.. - 9789189711396
- Konferensbidrag (refereegranskat)
Abstract
Ämnesord
Stäng
- Silicon carbide (SiC) power devices are steadily increasing their market share in various power electronics applications. However, they require low-inductive packaging in order to realize their full potential. In this research, low-inductive layouts for half-bridge power modules, using a direct bonded copper (DBC) substrate, that are suitable for SiC power devices, were designed and tested. To reduce the negative effects of the switching transients on the gate voltage, flexible printed circuit boards (PCBs) were used to interconnect the gate and source pins of the module with the corresponding pads of the power chips. In addition, conductive springs were used as low inductive, solder-free contacts for the module power terminals. The module casing and lid were produced using additive manufacturing, also known as 3D printing, to create a compact design. It is shown that the inductance of this module is significantly lower than the commercially available modules.
Ämnesord
- NATURVETENSKAP -- Fysik (hsv//swe)
- NATURAL SCIENCES -- Physical Sciences (hsv//eng)
Nyckelord
- low inductive module
- parasitic inductance
- Power electronics packaging
- SiC devices
- Competition
- Electric power system interconnection
- Flexible electronics
- Inductance
- Integrated circuit interconnects
- Microelectronics
- Printed circuit boards
- Silicon carbide
- Flexible printed-circuit board
- Market share
- Parasitic inductances
- Power electronics modules
- Printed circuit board interconnections
- Silicon carbide devices
- Silicon carbide power
- Silicon-carbide power devices
- 3D printers
Publikations- och innehållstyp
- ref (ämneskategori)
- kon (ämneskategori)
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- 2022 IMAPS Nordic Conference on Microelectronics Packaging, NordPac 2022 (Sök värdpublikationen i LIBRIS)
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