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Sn-3.0Ag-0.5Cu Nano...
Sn-3.0Ag-0.5Cu Nanocomposite Solder Reinforced With Bi2Te3 Nanoparticles
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- Chen, Si, 1981 (författare)
- Chalmers tekniska högskola,Chalmers University of Technology
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- Luo, Xin, 1983 (författare)
- Chalmers tekniska högskola,Chalmers University of Technology
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- Jiang, Di, 1983 (författare)
- Chalmers tekniska högskola,Chalmers University of Technology
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visa fler...
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- Ye, L. (författare)
- SHT Smart High-Tech AB
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- Edwards, Michael, 1986 (författare)
- Chalmers tekniska högskola,Chalmers University of Technology
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- Liu, Johan, 1960 (författare)
- Chalmers tekniska högskola,Chalmers University of Technology
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visa färre...
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(creator_code:org_t)
- Institute of Electrical and Electronics Engineers (IEEE), 2015
- 2015
- Engelska.
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Ingår i: IEEE Transactions on Components, Packaging and Manufacturing Technology. - : Institute of Electrical and Electronics Engineers (IEEE). - 2156-3985 .- 2156-3950. ; 5:8, s. 1186-1196
- Relaterad länk:
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http://dx.doi.org/10...
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https://research.cha...
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https://doi.org/10.1...
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Abstract
Ämnesord
Stäng
- Nanocomposite solders are regarded as one of the most promising interconnect materials for the high-density electronic packaging due to their high mechanical strength and fine microstructure. However, the developments of nanocomposite solders have been limited by the inadequate compatibility between nanoparticles and solder matrix with respect to density, hardness, coefficient of thermal expansion, and surface activity. The compatibility issue will lead to a huge loss of nanoparticles from the solder matrix after the reflow soldering process. The thermal fatigue resistance of solder joint will also become degraded. Therefore, aiming to solve this problem, a novel nanocomposite solder consisting of Bi2Te3 semiconductor nanoparticles and Sn-3.0Ag-0.5Cu (SAC305) solder is presented. The effect of nanoparticles on the viscosity of solder paste and the void content of solder bump was first studied. Then, a series of analysis on the composition and microstructure of the solder bump were completed using transmission electron microscopy, X-ray diffraction, inductively coupled plasma-mass spectrometry, scanning electron microscopy, and energy dispersive X-ray spectroscopy. The survival rate of nanoparticles in the solder bump after reflow soldering process reaches as high as 80%. The refined microstructure was observed from the cross section of the nanocomposite solders. The shear test showed that the average mechanical strength of SAC305 solder after the addition of Bi2Te3 nanoparticles was higher. Meanwhile, no thermal fatigue resistance degradation was detected in the nanocomposite solder after 1000 thermal cycles in the range of -40 degrees C to 115 degrees C.
Ämnesord
- TEKNIK OCH TEKNOLOGIER -- Nanoteknik (hsv//swe)
- ENGINEERING AND TECHNOLOGY -- Nano-technology (hsv//eng)
Nyckelord
- Nanocomposite solders
- Bi2Te3 nanoparticles
- Sn-3.0Ag-0.5Cu
Publikations- och innehållstyp
- art (ämneskategori)
- ref (ämneskategori)
Hitta via bibliotek
Till lärosätets databas
- Av författaren/redakt...
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Chen, Si, 1981
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Luo, Xin, 1983
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Jiang, Di, 1983
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Ye, L.
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Edwards, Michael ...
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Liu, Johan, 1960
- Om ämnet
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- TEKNIK OCH TEKNOLOGIER
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TEKNIK OCH TEKNO ...
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och Nanoteknik
- Artiklar i publikationen
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IEEE Transaction ...
- Av lärosätet
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Chalmers tekniska högskola