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Resolving Impurities in Atomic Layer Deposited Aluminum Nitride through Low Cost, High Efficiency Precursor Design

Buttera, Sydney C. (author)
Carleton Univ, Canada
Rouf, Polla (author)
Linköpings universitet,Kemi,Tekniska fakulteten
Deminskyi, Petro (author)
Linköpings universitet,Kemi,Tekniska fakulteten
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O´brien, Nathan (author)
Linköpings universitet,Kemi,Tekniska fakulteten
Pedersen, Henrik (author)
Linköpings universitet,Kemi,Tekniska fakulteten
Barry, Sean T. (author)
Carleton Univ, Canada
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 (creator_code:org_t)
2021-07-12
2021
English.
In: Inorganic Chemistry. - : AMER CHEMICAL SOC. - 0020-1669 .- 1520-510X. ; 60:15, s. 11025-11031
  • Journal article (peer-reviewed)
Abstract Subject headings
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  • A heteroleptic amidoalane precursor is presented as a more suitably designed candidate to replace trimethylaluminum (TMA) for atomic layer deposition of aluminum nitride (AlN). The lack of C-Al bonds and the strongly reducing hydride ligands in [AlH2(NMe2)](3) (1) were specifically chosen to limit impurities in target aluminum nitride (AlN) films. Compound 1 is made in a high yield, scalable synthesis involving lithium aluminum hydride and dimethylammonium chloride. It has a vapor pressure of 1 Torr at 40 degrees C and evaporates with negligible residual mass in thermogravimetric experiments. Ammonia (NH3) plasma and 1 in an atomic layer deposition (ALD) process produced crystalline AlN films above 200 degrees C with an Al:N ratio of 1.04. Carbon and oxygen impurities in resultant AlN films were reduced to <1% and <2%, respectively. By using a precursor with a rational and advantageous design, we can improve the material quality of AlN films compared to those deposited using the industrial standard trimethylaluminum and could reduce material cost by up to 2 orders of magnitude.

Subject headings

NATURVETENSKAP  -- Kemi -- Oorganisk kemi (hsv//swe)
NATURAL SCIENCES  -- Chemical Sciences -- Inorganic Chemistry (hsv//eng)

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