WFRF:(Singh Pratap)
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- Singh, Bhanu PratapKTH,Elkraftteknik (author)
Analyzing the Impact of Die Positions inside the Power Module on the Reliability of Solder Layers for Different Power Cycling Scenarios
- Article/chapterEnglish2023
Publisher, publication year, extent ...
- Institute of Electrical and Electronics Engineers (IEEE),2023
- printrdacarrier
Numbers
- LIBRIS-ID:oai:DiVA.org:kth-333344
- https://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-333344URI
- https://doi.org/10.1109/EuroSimE56861.2023.10100764DOI
Supplementary language notes
- Language:English
- Summary in:English
Part of subdatabase
- SwePubSwePub
Classification
Notes
- Part of proceedings ISBN 979-8-3503-4597-1QC 20231031
- Solder layers, used as bonding material inside the power module to attach the semiconductor die on Direct Bond Copper (DBC) substrate and DBC substrate on baseplate, are one of the regions most prone to failure. The failure usually occurs in the form of solder cracks and depends on various operating conditions, such as-maximum temperature, temperature swing, and heating time. The cracks generated inside the solder layers can eventually result in its delamination. Power modules are usually power cycled to estimate the failure sites and mechanisms. However, the failure mechanisms can vary depending on the frequency, amplitude, and range of the temperature in the Power Cycling Tests (PCT). In this study, we have used the Finite Element Method (FEM) in COMSOL Multiphysics to analyse the impact of the PCT on both die attach, and baseplate attach solder layers. Additionally, the effect of the degree of asymmetry in the die position on the reliability of both the solder layers are analysed. The FEA (Finite Element Analysis) results are analysed to have a better understanding about the aspects impacting the lifetime of the power module.
Subject headings and genre
- TEKNIK OCH TEKNOLOGIER Elektroteknik och elektronik Annan elektroteknik och elektronik hsv//swe
- ENGINEERING AND TECHNOLOGY Electrical Engineering, Electronic Engineering, Information Engineering Other Electrical Engineering, Electronic Engineering, Information Engineering hsv//eng
- finite element method
- lifetime estimation
- power cycling
- Power module
- solder
- viscoplasticity
Added entries (persons, corporate bodies, meetings, titles ...)
- Shirong, WangKTH(Swepub:kth)u1d0pfaq (author)
- Choudhury, Khaled RedwanUniversity of Warwick, Coventry, UK (author)
- Norrga, Staffan,1968-KTH,Elkraftteknik(Swepub:kth)u1sjojho (author)
- Nee, Hans-Peter,1963-KTH,Elkraftteknik(Swepub:kth)u1ycw7mc (author)
- KTHElkraftteknik (creator_code:org_t)
Related titles
- In:2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023: Institute of Electrical and Electronics Engineers (IEEE)
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