Qualification and Integration Aspects of the DSSC Mega-Pixel X-Ray Imager

The focal-plane module is the key component of the DEPFET sensor with signal compression (DSSC) mega-pixel X-ray imager and handles the data of 128 ×512 pixels. We report on assembly-related aspects, discuss the experimental investigation of bonding behavior of different adhesives, and present the metrology and electrical test results of the production. The module consists of two silicon (Si) sensors with flip-chip connected CMOS integrated circuits, a Si-heat spreader, a low-temperature co-fired ceramics circuit board, and a molybdenum frame. A low-modulus urethane-film adhesive fills the gaps between on-board components and frame. It is also used between board and heat spreader, reduces the misfit strain, and minimizes the module warpage very efficiently. The heat spreader reduces the on-board temperature gradient by about one order of magnitude. The placement precision of the bare modules to each other and the frame is characterized by a standard deviation below 10 and 65 μ m, respectively. The displacement due to the in-plane rotation and vertical tilting errors remains below 80 and 50 μm, respectively. The deflection of the sensor plane shows a mean value below 30 μm with a standard deviation below 15 μm. Less than 4% of the application-specified integrated circuits (ASICs) exhibit a malfunction. More than two-thirds of the sensors have a maximum leakage current below 1 μA. © 1963-2012 IEEE.

TEKNIK OCH TEKNOLOGIER Elektroteknik och elektronik hsv//swe
ENGINEERING AND TECHNOLOGY Electrical Engineering, Electronic Engineering, Information Engineering hsv//eng
Adhesive strength
assembly
circuit testing
hybrid integrated circuits
image sensor
metrology
packaging technology
X-ray detector
Adhesives
Flip chip devices
Heating equipment
Image sensors
Integrated circuit testing
Measurement
Pixels
Spreaders
Statistics
Temperature
Experimental investigations
Low temperature co-fired ceramics
On-board temperatures
Packaging technologies
Signal compression
Standard deviation
X ray detectors

Klar, H. (author)
Kalavakuru, P. (author)
Reckleben, C. (author)
Venzmer, A. (author)
Wustenhagen, E. (author)
Schappeit, R. (author)
Zeides, O. -C (author)
Okrent, F. (author)
Wunderer, C. (author)
Lemke, M. (author)
Graafsma, H.Deutsches Elektronen-Synchrotron DESY, Hamburg, Germany(Swepub:miun)exheigra (author)
Schlosser, I. (author)
Manghisoni, M. (author)
Riceputi, E. (author)
Aschauer, S. (author)
Struder, L. (author)
Soldat, J. (author)
Tangl, M. (author)
Erdinger, F. (author)
Kugel, A. (author)
Fischer, P. (author)
Andricek, L. (author)
Ninkovic, J. (author)
Turcato, M. (author)
Porro, M. (author)
Deutsches Elektronen-Synchrotron DESY, Hamburg, Germany (creator_code:org_t)

In:IEEE Transactions on Nuclear Science: Institute of Electrical and Electronics Engineers Inc.66:8, s. 1966-19750018-94991558-1578

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