WFRF:(Manghisoni M.)
Sökning: WFRF:(Manghisoni M.) > Qualification and I...
LIBRIS Formathandbok (Information om MARC21)
| Fältnamn | Indikatorer | Metadata |
|---|---|---|
| 000 | 04465naa a2200877 4500 | |
| 001 | oai:DiVA.org:miun-41481 | |
| 003 | SwePub | |
| 008 | 210305s2019 | |||||||||||000 ||eng| | |
| 024 | 7 | a https://urn.kb.se/resolve?urn=urn:nbn:se:miun:diva-414812 URI |
| 024 | 7 | a https://doi.org/10.1109/TNS.2019.29274212 DOI |
| 040 | a (SwePub)miun | |
| 041 | a engb eng | |
| 042 | 9 SwePub | |
| 072 | 7 | a ref2 swepub-contenttype |
| 072 | 7 | a art2 swepub-publicationtype |
| 100 | 1 | a Hansen, K.4 aut |
| 245 | 1 0 | a Qualification and Integration Aspects of the DSSC Mega-Pixel X-Ray Imager |
| 264 | 1 | b Institute of Electrical and Electronics Engineers Inc.c 2019 |
| 338 | a print2 rdacarrier | |
| 520 | a The focal-plane module is the key component of the DEPFET sensor with signal compression (DSSC) mega-pixel X-ray imager and handles the data of 128 ×512 pixels. We report on assembly-related aspects, discuss the experimental investigation of bonding behavior of different adhesives, and present the metrology and electrical test results of the production. The module consists of two silicon (Si) sensors with flip-chip connected CMOS integrated circuits, a Si-heat spreader, a low-temperature co-fired ceramics circuit board, and a molybdenum frame. A low-modulus urethane-film adhesive fills the gaps between on-board components and frame. It is also used between board and heat spreader, reduces the misfit strain, and minimizes the module warpage very efficiently. The heat spreader reduces the on-board temperature gradient by about one order of magnitude. The placement precision of the bare modules to each other and the frame is characterized by a standard deviation below 10 and 65 μ m, respectively. The displacement due to the in-plane rotation and vertical tilting errors remains below 80 and 50 μm, respectively. The deflection of the sensor plane shows a mean value below 30 μm with a standard deviation below 15 μm. Less than 4% of the application-specified integrated circuits (ASICs) exhibit a malfunction. More than two-thirds of the sensors have a maximum leakage current below 1 μA. © 1963-2012 IEEE. | |
| 650 | 7 | a TEKNIK OCH TEKNOLOGIERx Elektroteknik och elektronik0 (SwePub)2022 hsv//swe |
| 650 | 7 | a ENGINEERING AND TECHNOLOGYx Electrical Engineering, Electronic Engineering, Information Engineering0 (SwePub)2022 hsv//eng |
| 653 | a Adhesive strength | |
| 653 | a assembly | |
| 653 | a circuit testing | |
| 653 | a hybrid integrated circuits | |
| 653 | a image sensor | |
| 653 | a metrology | |
| 653 | a packaging technology | |
| 653 | a X-ray detector | |
| 653 | a Adhesives | |
| 653 | a Flip chip devices | |
| 653 | a Heating equipment | |
| 653 | a Image sensors | |
| 653 | a Integrated circuit testing | |
| 653 | a Measurement | |
| 653 | a Pixels | |
| 653 | a Spreaders | |
| 653 | a Statistics | |
| 653 | a Temperature | |
| 653 | a Experimental investigations | |
| 653 | a Low temperature co-fired ceramics | |
| 653 | a On-board temperatures | |
| 653 | a Packaging technologies | |
| 653 | a Signal compression | |
| 653 | a Standard deviation | |
| 653 | a X ray detectors | |
| 700 | 1 | a Klar, H.4 aut |
| 700 | 1 | a Kalavakuru, P.4 aut |
| 700 | 1 | a Reckleben, C.4 aut |
| 700 | 1 | a Venzmer, A.4 aut |
| 700 | 1 | a Wustenhagen, E.4 aut |
| 700 | 1 | a Schappeit, R.4 aut |
| 700 | 1 | a Zeides, O. -C4 aut |
| 700 | 1 | a Okrent, F.4 aut |
| 700 | 1 | a Wunderer, C.4 aut |
| 700 | 1 | a Lemke, M.4 aut |
| 700 | 1 | a Graafsma, H.u Deutsches Elektronen-Synchrotron DESY, Hamburg, Germany4 aut0 (Swepub:miun)exheigra |
| 700 | 1 | a Schlosser, I.4 aut |
| 700 | 1 | a Manghisoni, M.4 aut |
| 700 | 1 | a Riceputi, E.4 aut |
| 700 | 1 | a Aschauer, S.4 aut |
| 700 | 1 | a Struder, L.4 aut |
| 700 | 1 | a Soldat, J.4 aut |
| 700 | 1 | a Tangl, M.4 aut |
| 700 | 1 | a Erdinger, F.4 aut |
| 700 | 1 | a Kugel, A.4 aut |
| 700 | 1 | a Fischer, P.4 aut |
| 700 | 1 | a Andricek, L.4 aut |
| 700 | 1 | a Ninkovic, J.4 aut |
| 700 | 1 | a Turcato, M.4 aut |
| 700 | 1 | a Porro, M.4 aut |
| 710 | 2 | a Deutsches Elektronen-Synchrotron DESY, Hamburg, Germany4 org |
| 773 | 0 | t IEEE Transactions on Nuclear Scienced : Institute of Electrical and Electronics Engineers Inc.g 66:8, s. 1966-1975q 66:8<1966-1975x 0018-9499x 1558-1578 |
| 856 | 4 8 | u https://urn.kb.se/resolve?urn=urn:nbn:se:miun:diva-41481 |
| 856 | 4 8 | u https://doi.org/10.1109/TNS.2019.2927421 |
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- Hansen, K.
- Klar, H.
- Kalavakuru, P.
- Reckleben, C.
- Venzmer, A.
- Wustenhagen, E.
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- Schappeit, R.
- Zeides, O. -C
- Okrent, F.
- Wunderer, C.
- Lemke, M.
- Graafsma, H.
- Schlosser, I.
- Manghisoni, M.
- Riceputi, E.
- Aschauer, S.
- Struder, L.
- Soldat, J.
- Tangl, M.
- Erdinger, F.
- Kugel, A.
- Fischer, P.
- Andricek, L.
- Ninkovic, J.
- Turcato, M.
- Porro, M.
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