WFRF:(Liu Johan 1960)
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Effect of Boron Nitride Particle Geometry on the Thermal Conductivity of a Boron Nitride Enhanced Polymer Composite Film
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- Liu, Ya, 1991 (author)
- Chalmers tekniska högskola,Chalmers University of Technology,Fudan University
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- Wang, Nan (author)
- SHT Smart High-Tech AB
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- Ye, L. (author)
- SHT Smart High-Tech AB
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- (creator_code:org_t)
- 2019
- 2019
- English.
- In: THERMINIC 2019 - 2019 25th International Workshop Thermal Investigations of ICs and Systems.
- Conference paper (peer-reviewed)
Abstract
Subject headings
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- Hexagonal Boron Nitride (h-BN) has been considered as a promising enhancement filler for thermal management due to its high thermal conductivity, structural stability, and super electrical resistivity. Numerus studies have reported using BN as an enhancement filler to achieve high thermally conductive polymer based thermal management materials. However, there are limited data regarding the influence of the flake size of BN sheets to the thermal management property of BN filled composites. In this work, three h-BN size geometries, including microscale h-BN powder, h-BN nanosheets, and a mixture of micro and nanoscale h-BN, were studied regarding its thermal transfer performance. The results show that h-BN nanosheets are able to achieve the highest in-plane thermal conductivity with loading from 0 - 5 wt% while for the through-plane thermal conductivity, all three geometries show similar thermal property when the filler loading less than 5 wt%. Through-plane thermal conductivity exhibits a sudden increase to 5.69 W m-1 K-1 at a loading of 5 wt%..
Subject headings
- TEKNIK OCH TEKNOLOGIER -- Materialteknik -- Keramteknik (hsv//swe)
- ENGINEERING AND TECHNOLOGY -- Materials Engineering -- Ceramics (hsv//eng)
- NATURVETENSKAP -- Kemi -- Materialkemi (hsv//swe)
- NATURAL SCIENCES -- Chemical Sciences -- Materials Chemistry (hsv//eng)
- TEKNIK OCH TEKNOLOGIER -- Materialteknik -- Kompositmaterial och -teknik (hsv//swe)
- ENGINEERING AND TECHNOLOGY -- Materials Engineering -- Composite Science and Engineering (hsv//eng)
Keyword
- Conducting polymers
- Geometry
- III-V semiconductors
- Nanosheets
- thermally conductive
- Fillers
- Composite films
- Boron nitride
- Integrated circuits
Publication and Content Type
- kon (subject category)
- ref (subject category)
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- By the author/editor
- Liu, Ya, 1991
- Wang, Nan
- Ye, L.
- Lu, Hongbin
- Liu, Johan, 1960
- About the subject
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- ENGINEERING AND TECHNOLOGY
- ENGINEERING AND ...
- and Materials Engine ...
- and Ceramics
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- NATURAL SCIENCES
- NATURAL SCIENCES
- and Chemical Science ...
- and Materials Chemis ...
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- ENGINEERING AND TECHNOLOGY
- ENGINEERING AND ...
- and Materials Engine ...
- and Composite Scienc ...
- Articles in the publication
- THERMINIC 2019 - ...
- By the university
- Chalmers University of Technology
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