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Sökning: WFRF:(Kopp S.) > (2005-2009) > Very compact FTTH D...

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FältnamnIndikatorerMetadata
00004882naa a2201081 4500
001oai:DiVA.org:kth-82997
003SwePub
008120212s2008 | |||||||||||000 ||eng|
024a https://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-829972 URI
024a https://doi.org/10.1117/12.7797462 DOI
040 a (SwePub)kth
041 a engb eng
042 9 SwePub
072 7a ref2 swepub-contenttype
072 7a kon2 swepub-publicationtype
100a Kopp, C.4 aut
2451 0a Very compact FTTH Diplexer design using advanced wafer level fabrication methods
264 1a Strasbourg :b SPIE,c 2008
338 a print2 rdacarrier
500 a QC 20120301
520 a FTTH networks require implementing a diplexer at each user termination. According to most of the standards, this diplexer detects a download signal beam at 1.49ÎŒm and emits an upload signal beam at 1.31ÎŒm on the same single mode fibre. Both signals exhibit datarate speed below 2.5Gbps. Today, most of the diplexers are obtained by actively aligning a set of individual optoelectronic components and micro-optics. However, new manufacturing solutions satisfying very low cost and mass production capability requirements of this market would help to speed the massive spreading of this technology. In this paper, we present an original packaging design to manufacture Diplexer Optical Sub-Assembly for FTTH application. A dual photodiode is stacked over a VCSEL and detects both the download signal beam at 1.49ÎŒm passing through the laser and one part of the upload signal beam at 1.31ÎŒm for monitoring. To satisfy this approach, an innovative VCSEL has been designed to have a very high transmission at 1.49ÎŒm. All these components are mounted on a very small circuit board on glass including also integrated circuits such as transimpedance amplifier. So, the device combines advanced optoelectronic components and highly integrated Multi-Chip-Module on glass approach using collective wafer-level assembling technologies. For the single mode fibre optical coupling, active and passive alignment solutions are considered.
650 7a NATURVETENSKAPx Fysikx Den kondenserade materiens fysik0 (SwePub)103042 hsv//swe
650 7a NATURAL SCIENCESx Physical Sciencesx Condensed Matter Physics0 (SwePub)103042 hsv//eng
653 a Diplexer
653 a FTTH
653 a Optical interconnects
653 a Packaging
653 a VCSEL
653 a Amplifiers (electronic)
653 a Architectural design
653 a Chip scale packages
653 a Computer networks
653 a Differential amplifiers
653 a Electronic equipment manufacture
653 a Electronics industry
653 a Glass
653 a Integrated circuits
653 a Manufacture
653 a Metropolitan area networks
653 a Microelectronics
653 a Network protocols
653 a Networks (circuits)
653 a Optical design
653 a Optics
653 a Pulsed laser deposition
653 a Single mode fibers
653 a Standards
653 a Surface emitting lasers
653 a Technology
653 a (OTDR) technology
653 a Diplexers
653 a Fiber-to-the-home (FTTH) application
653 a Filber-to-the-home (FTTH) networks
653 a High transmission
653 a Highly integrated
653 a Individual (PSS 544-7)
653 a Low costs
653 a Manufacturing solutions
653 a Mass production
653 a Micro-optics
653 a Multi chip module (MCM)
653 a Optical couplings
653 a Optical Sub-Assembly (OSA)
653 a Optoelectronic components
653 a Packaging designs
653 a Passive alignment
653 a Signal beams
653 a Single mode fibres
653 a Trans-impedance amplifier (TIA)
653 a Wafer level fabrication
653 a Wafer levels
653 a Multiplexing equipment
700a Grosse, P.4 aut
700a Gilet, P.4 aut
700a Olivier, N.4 aut
700a Chelnokov, A.4 aut
700a Fulbert, L.4 aut
700a Bernabé, S.4 aut
700a Rossat, C.4 aut
700a Hamelin, R.4 aut
700a Hamberg, I.4 aut
700a Lundqvist, L.4 aut
700a Chitica, N.4 aut
700a Hammar, M.4 aut
700a Berggren, Jesper4 aut
700a Junique, S.4 aut
700a Wang, Q.4 aut
700a Almqvist, S.4 aut
700a Sillans, C.4 aut
773t MICRO-OPTICS 2008d Strasbourg : SPIE
856u http://www.scopus.com/inward/record.url?eid=2-s2.0-45149086068&partnerID=40&md5=c91c2afd3b341c5cf1114a02ff068a40
8564 8u https://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-82997
8564 8u https://doi.org/10.1117/12.779746

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