Wire-bonder-assisted integration of non-bondable SMA wires into MEMS substrates

• This paper reports on a novel technique for the integration of NiTi shape memory alloy wires and other non-bondable wire materials into silicon-based microelectromechanical system structures using a standard wire-bonding tool. The efficient placement and alignment functions of the wire-bonding tool are used to mechanically attach the wire to deep-etched silicon anchoring and clamping structures. This approach enables a reliable and accurate integration of wire materials that cannot be wire bonded by traditional means.

Keyword

Bonding

Electromechanical devices

Integration

MEMS

Publication and Content Type

ref (subject category)

art (subject category)