Heterogeneous 3D integration of 17 μm pitch Si/SiGe quantum well bolometer arrays for infrared imaging systems

Forsberg, Fredrik (author): KTH,Mikro- och nanosystemteknik,KTH Royal Institute of Technology, Sweden

Fischer, Andreas C., 1982- (author): KTH,Mikro- och nanosystemteknik,KTH Royal Institute of Technology, Sweden

Roxhed, Niclas (author): KTH,Mikro- och nanosystemteknik,KTH Royal Institute of Technology, Sweden

Stemme, Göran (author): KTH,Mikro- och nanosystemteknik,KTH Royal Institute of Technology, Sweden

Niklaus, Frank (author): KTH,Mikro- och nanosystemteknik,KTH Royal Institute of Technology, Sweden

(creator_code:org_t)

2013-03-06
2013
English.
In: Journal of Micromechanics and Microengineering. - : IOP Publishing. - 0960-1317 .- 1361-6439. ; 23:4

Related links:: https://urn.kb.se/re...; show more...; https://doi.org/10.1...; https://urn.kb.se/re...; show less...

Abstract Subject headings

This paper reports on the realization of 17 μm × 17 μm pitch bolometer arrays for uncooled infrared imagers. Microbolometer arrays have been available in primarily defense applications since the mid-1980s and are typically based on deposited thin films on top of CMOS wafers that are surface-machined into sensor pixels. This paper instead focuses on the heterogeneous integration of monocrystalline Si/SiGe quantum-well-based thermistor material in a CMOS-compliant process using adhesive wafer bonding. The high-quality monocrystalline thermistor material opens up for potentially lower noise compared to commercially available uncooled microbolometer arrays together with a competitive temperature coefficient of resistance (TCR). Characterized bolometers had a TCR of -2.9% K-1 in vacuum, measured thermal conductances around 5 × 10-8 W K-1 and thermal time constants between 4.9 and 8.5 ms, depending on the design. Complications in the fabrication of stress-free bolometer legs and low-noise contacts are discussed and analyzed.

By the author/editor: Forsberg, Fredri ...; Fischer, Andreas ...; Roxhed, Niclas; Samel, Björn; Ericsson, Per; Stemme, Göran; show more...; Niklaus, Frank; show less...

Kungliga biblioteket hanterar dina personuppgifter i enlighet med EU:s dataskyddsförordning (2018), GDPR. Läs mer om hur det funkar här.
Så här hanterar KB dina uppgifter vid användning av denna tjänst.