Integrated silicon photonic MEMS

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Integrated silicon photonic MEMS

Quack, Niels (författare): Ecole Polytech Fed Lausanne EPFL, CH-1015 Lausanne, Switzerland.;Univ Sydney, Sch Aerosp Mech & Mechatron Engn, Camperdown, NSW 2006, Australia.

Takabayashi, Alain Yuji (författare): Ecole Polytech Fed Lausanne EPFL, CH-1015 Lausanne, Switzerland.

Sattari, Hamed (författare): Ecole Polytech Fed Lausanne EPFL, CH-1015 Lausanne, Switzerland.;Swiss Ctr Elect & Microtechnol CSEM, CH-2002 Neuchatel, Switzerland.

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Edinger, Pierre (författare): KTH,Mikro- och nanosystemteknik

Jo, Gaehun, 1992- (författare): KTH,Mikro- och nanosystemteknik

Bleiker, Simon J. (författare): KTH,Mikro- och nanosystemteknik

Errando-Herranz, Carlos, 1989- (författare): KTH,Mikro- och nanosystemteknik

Gylfason, Kristinn, 1978- (författare): KTH,Mikro- och nanosystemteknik

Niklaus, Frank, 1971- (författare): KTH,Mikro- och nanosystemteknik

Khan, Umar (författare): Univ Ghent, Dept Informat Technol, Photon Res Grp, IMEC, Technol Pk Zwijnaarde 126, B-9052 Ghent, Belgium.

Verheyen, Peter (författare): Si Photon Grp, Imec vzw 3DSIP Dept, Kapeldreef 75, B-3001 Leuven, Belgium.

Mallik, Arun Kumar (författare): Tyndall Natl Inst, Lee Maltings Complex Dyke Parade, Cork T12 R5CP, Ireland.

Lee, Jun Su (författare): Tyndall Natl Inst, Lee Maltings Complex Dyke Parade, Cork T12 R5CP, Ireland.

Jezzini, Moises (författare): Tyndall Natl Inst, Lee Maltings Complex Dyke Parade, Cork T12 R5CP, Ireland.

Zand, Iman (författare): Department of Information Technology, Photonics Research Group, Ghent University - IMEC, Technologiepark-Zwijnaarde 126, 9052, Gent, Belgium

Morrissey, Padraic (författare): Tyndall Natl Inst, Lee Maltings Complex Dyke Parade, Cork T12 R5CP, Ireland.

Antony, Cleitus (författare): Tyndall Natl Inst, Lee Maltings Complex Dyke Parade, Cork T12 R5CP, Ireland.

O'Brien, Peter (författare): Tyndall Natl Inst, Lee Maltings Complex Dyke Parade, Cork T12 R5CP, Ireland.

Bogaerts, Wim (författare): Univ Ghent, Dept Informat Technol, Photon Res Grp, IMEC, Technol Pk Zwijnaarde 126, B-9052 Ghent, Belgium.

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Ecole Polytech Fed Lausanne EPFL, CH-1015 Lausanne, Switzerland;Univ Sydney, Sch Aerosp Mech & Mechatron Engn, Camperdown, NSW 2006, Australia. Ecole Polytech Fed Lausanne EPFL, CH-1015 Lausanne, Switzerland. (creator_code:org_t)

2023-03-20
2023
Engelska.
Ingår i: MICROSYSTEMS & NANOENGINEERING. - : Springer Nature. - 2055-7434. ; 9:1

Relaterad länk:: https://doi.org/10.1...; visa fler...; https://urn.kb.se/re...; https://doi.org/10.1...; visa färre...

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Silicon photonics has emerged as a mature technology that is expected to play a key role in critical emerging applications, including very high data rate optical communications, distance sensing for autonomous vehicles, photonic-accelerated computing, and quantum information processing. The success of silicon photonics has been enabled by the unique combination of performance, high yield, and high-volume capacity that can only be achieved by standardizing manufacturing technology. Today, standardized silicon photonics technology platforms implemented by foundries provide access to optimized library components, including low-loss optical routing, fast modulation, continuous tuning, high-speed germanium photodiodes, and high-efficiency optical and electrical interfaces. However, silicon's relatively weak electro-optic effects result in modulators with a significant footprint and thermo-optic tuning devices that require high power consumption, which are substantial impediments for very large-scale integration in silicon photonics. Microelectromechanical systems (MEMS) technology can enhance silicon photonics with building blocks that are compact, low-loss, broadband, fast and require very low power consumption. Here, we introduce a silicon photonic MEMS platform consisting of high-performance nano-opto-electromechanical devices fully integrated alongside standard silicon photonics foundry components, with wafer-level sealing for long-term reliability, flip-chip bonding to redistribution interposers, and fibre-array attachment for high port count optical and electrical interfacing. Our experimental demonstration of fundamental silicon photonic MEMS circuit elements, including power couplers, phase shifters and wavelength-division multiplexing devices using standardized technology lifts previous impediments to enable scaling to very large photonic integrated circuits for applications in telecommunications, neuromorphic computing, sensing, programmable photonics, and quantum computing.

Ämnesord

TEKNIK OCH TEKNOLOGIER -- Nanoteknik (hsv//swe)
ENGINEERING AND TECHNOLOGY -- Nano-technology (hsv//eng)

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