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LIBRIS Formathandbok  (Information om MARC21)
FältnamnIndikatorerMetadata
00003029naa a2200445 4500
001oai:DiVA.org:kth-23978
003SwePub
008100810s2004 | |||||||||||000 ||eng|
024a https://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-239782 URI
024a https://doi.org/10.1016/j.mseb.2004.07.0622 DOI
040 a (SwePub)kth
041 a engb eng
042 9 SwePub
072 7a ref2 swepub-contenttype
072 7a art2 swepub-publicationtype
100a Monakhov, E. V.4 aut
2451 0a Excimer laser annealing of shallow As and B doped layers
264 1b Elsevier BV,c 2004
338 a print2 rdacarrier
500 a QC 20100525 QC 20110927. Symposium on Material Science Issues in Advanced CMOS Source-Drain Engineeing held at the E-MRS 2004 Spring Meeting. Strasbourg, FRANCE. JAN 31, 2004
520 a Excimer laser annealing (ELA) of As-, B- and BF2-implanted Si has been studied by secondary ion mass spectrometry (SIMS), spreading resistance probe (SRP) and transmission electron microscopy (TEM). The implantations have been performed in the energy range from I to 30 keV with doses of 10(15)-10(16) cm(-2). ELA has been carried out with the energy densities in the range of 600-1200 mJ/cm(2) and the number of laser pulses from 1 to 10. It is shown that ELA results in a more uniform dopant distribution over the doped region with a more abrupt profile edge as compared to those after rapid thermal annealing (RTA). Besides, in contrast to RTA, ELA demonstrates a highly confined annealing effect, where the distribution of dopants below the melting region is not affected. SRP measurements demonstrate almost complete activation of the implanted dopants after ELA, and TEM does not reveal extended defects in the ELA-treated samples. The depth of the doped layers, abruptness of the profiles and the total doping dose as a function of ELA energy density and number of laser pulses are investigated. Computer simulations of ELA show a good agreement with the experimental data.
650 7a TEKNIK OCH TEKNOLOGIERx Elektroteknik och elektronik0 (SwePub)2022 hsv//swe
650 7a ENGINEERING AND TECHNOLOGYx Electrical Engineering, Electronic Engineering, Information Engineering0 (SwePub)2022 hsv//eng
653 a dopant
653 a ELA
653 a SIMS
653 a ion-implantation
653 a junctions
653 a boron
700a Svensson, B. G.4 aut
700a Linnarsson, Margareta K.u KTH,Mikroelektronik och informationsteknik, IMIT4 aut0 (Swepub:kth)u1x6y4ru
700a La Magna, A.4 aut
700a Privitera, V.4 aut
700a Camalleri, M.4 aut
700a Fortunato, G.4 aut
700a Mariucci, L.4 aut
710a KTHb Mikroelektronik och informationsteknik, IMIT4 org
773t Materials Science & Engineeringd : Elsevier BVg 114-15, s. 352-357q 114-15<352-357x 0921-5107x 1873-4944
8564 8u https://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-23978
8564 8u https://doi.org/10.1016/j.mseb.2004.07.062

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