Mechanical properties of a novel multi-scale silver paste for electronics interconnect application

• A novel nano-silver paste with characteristics of sintering at low temperature and operating at high temperature is one of the most promising interconnect materials in the semiconductor industry. This study focuses on the shear strength of sintered multi-scale silver paste synthesized by nano-silver particles, micro-silver particles and submicron silicon carbide particles coated with Ag (SCA). The silver paste was sintered at 250 °C without pressure. The shear strength reaches 9.22 MPa, with 64 wt.% nano-silver particles, 16.5 wt.% micro-silver particles and 1.5 wt.% SCA, respectively. With this, it shows great potential for high power electronics interconnect and cooing applications.

Ämnesord

TEKNIK OCH TEKNOLOGIER  -- Materialteknik -- Keramteknik (hsv//swe)

ENGINEERING AND TECHNOLOGY  -- Materials Engineering -- Ceramics (hsv//eng)

NATURVETENSKAP  -- Kemi -- Materialkemi (hsv//swe)

NATURAL SCIENCES  -- Chemical Sciences -- Materials Chemistry (hsv//eng)

TEKNIK OCH TEKNOLOGIER  -- Elektroteknik och elektronik (hsv//swe)

ENGINEERING AND TECHNOLOGY  -- Electrical Engineering, Electronic Engineering, Information Engineering (hsv//eng)

Nyckelord

Electronics packaging

SCA particles

High power electronics

Temperature

Shear strength

Sintered carbides

Silver paste

Silicon carbide

Semiconductor device manufacture

Mechanical properties

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